The overall development of RF technology must first meet the primary market requirements, which include achieving system modularization and integration while improving performance, as well as reducing the size and power consumption of RF circuits by increasing integration density. Building on this foundation, it is also essential to enhance the application capabilities of RF circuits in multi-standard and multi-mode environments based on the advancement of digital circuits. This is commonly referred to as "software-defined radio technology.".
With the continuous introduction of broadband wireless systems, the demand for channel utilization efficiency is increasing, posing new challenges to channel coding technologies and air interface technologies. For the radio frequency section, higher linearity and lower in-band and out-of-band noise requirements are demanded. The challenges for RF chips also include higher receiver sensitivity and lower noise figures, with excellent performance being the most fundamental requirement for products.
An important means to achieve high performance is to increase the complexity of RF circuits, which generally include three parts: transceivers, amplifiers, and switches. The current RF circuit is fundamentally a mixed signal circuit dominated by analog circuits. Although digitization is a trend in RF circuit chips nowadays, RF module technology is difficult to do without the support of high-performance analog technology. Therefore, the increasing complexity of RF circuits poses many challenges to reducing the size of RF chips. The RF end must focus on reducing power consumption, accelerating the integration of different processes, and lowering costs. This can be achieved in two directions, one is to adopt a new SIP architecture, which integrates chips from different processes into one packaging module, such as front-end amplifiers and antenna receivers! Switch or laminate the amplifier and transceiver onto the same substrate to create a module.
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